Xiaomi unveils 3-nm Xring D100 smart-driving chip for 2027 launch

Xiaomi has unveiled the Xring D100, the company says is China's first high-computing-power smart-driving chip manufactured on a 3-nanometer process node.

The D100 is designed to run AI driving models with up to 200 billion parameters locally within the vehicle, eliminating or reducing the need for cloud-dependent processing for complex autonomous-driving tasks.

Xiaomi said the chip is targeted for commercial deployment in 2027, though no specific model or vehicle platform was named.

Domestic chip ambitions

The announcement marks a significant step in Xiaomi's efforts to develop in-house silicon for its intelligent-driving systems. The Xiaomi SU7 currently relies on Qualcomm and NVIDIA computing platforms for its driver-assistance features, making the D100 a potential cornerstone for future self-developed ADAS capability.

Several Chinese automakers and tech firms — including Huawei, Horizon Robotics, and NIO — have been pursuing domestically produced smart-driving chips to reduce reliance on foreign suppliers and keep pace with the rapid advancement of in-vehicle AI models.

Why 3 nm matters

Moving to a 3-nm process is a notable upgrade from the 5- to 7-nm nodes common in many automotive-grade SoCs today. A smaller node generally delivers higher performance per watt, which is critical for running large language and perception models inside a vehicle without excessive power draw or thermal output.

The 200-billion-parameter figure places the D100 among the most compute-hungry automotive chips being discussed in China's EV sector, where end-to-end autonomous-driving models are becoming the industry norm.

Full specifications, including inference performance, memory configuration, and power consumption, were not disclosed.